Your cart is empty

JIS C 5630-13-2014

$22.00

The files are in electronic format(PDF/DOC/DOCX) and will be sent to your email within hours.
JIS Standard Title:Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
JIS Standard NO.:JIS C 5630-13
Language:Japanese


Add to Cart:

  • 1000 Units in Stock


This product was added to our catalog on Sunday 18 January, 2015.

walitefree