JIS C 5070:2002Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Abstract
This Japanese Industrial Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this Standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause determination, and result in assembly problems such as poor solderability, delamination and "popcorning".
Details
Status |
Superseded |
Pages |
8 |
Language |
English |
Supersedes |
|
Superseded By |
JIS C 5070:2009 |
DocumentFormat |
PDF(Copy/Paste/Networkable) |
Published |
20-03-2002 |
History |
|
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.