JIS Z 3198-4:2003 English Edition

Test methods for lead-free solders Part 4: Methods for solderbility test by a wetting balance method and a contact angle method

Abstract

This Standard specifies the methods for solderability test of a wetting balance method and a contact angle method of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.

Details

Note
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