JIS Z 3198-6:2003Test methods for lead-free solders Part 6: Methods for 45?pull test of solder joints on QFP lead
Abstract
This Standard specifies methods for 45 deg. pull test of solder joints on QFP lead to be used principally for wiring connection, components connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
Details
| Status |
Current |
| Pages |
3 |
| Language |
English |
| Supersedes |
|
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-06-2003 |
| History |
2003(R2013) [21/10/2013]
2003(R2008) [01/10/2008]
2003 [20/06/2003] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.
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