JIS Z 3198-3:2003Test methods for lead-free solders Part 3: Methods for spread test
Abstract
This Standard specifies the method of spread test of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
Details
| Status |
Current |
| Pages |
4 |
| Language |
English |
| Supersedes |
|
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-06-2003 |
| History |
2003(R2013) [21/10/2013]
2003(R2008) [01/10/2008]
2003 [20/06/2003] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.
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