JIS Z 3198-7:2003Test methods for lead-free solders Part 7: Methods for shear strength of solder joints on chip components
Abstract
This Standard specifies test methods for shear strength of solder joints on chip components by using lead-free solder to be used principally for wiring connection of electrical machining and apparatus, electronic apparatus, communication equipment or the like, wiring connection of components and the like.
Details
| Status |
Current |
| Pages |
3 |
| Language |
English |
| Supersedes |
|
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-06-2003 |
| History |
2003(R2013) [21/10/2013]
2003(R2008) [01/10/2008]
2003 [20/06/2003] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.
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