JIS C 0099:2005Environmental testing: Tests - Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
Abstract
This Japanese Industrial Standard specifies the methods for testing the solderability of the metal terminal or the electrode of the surface mounting devices mounted on a printed wiring board by wetting balance using lead-free solder paste.
Details
| Status |
Superseded |
| Pages |
26 |
| Language |
English |
| Supersedes |
|
| Superseded By |
JIS C 60068-2-83:2014 |
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-03-2005 |
| History |
|
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.
Your cart is empty
