JIS C 60068-2-54:2009Environmental testing Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Abstract
This Japanese Industrial Standard outlines the solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.
Details
| Status |
Current |
| Pages |
18 |
| Language |
English |
| Supersedes |
JIS C 60068-2-54:1996 |
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-07-2009 |
| History |
2009(R2014) [20/10/2014]
2009 [20/07/2009]
96(R2007) [20/03/2007]
96(R2001) [20/02/2001]
96 [01/07/1996]
90 [01/08/1991] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.
Your cart is empty
