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JIS C 60068-2-69:2009 English Edition

$23.20
JIS C 60068-2-69:2009

Environmental testing Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Abstract

This Japanese Industrial Standard specifies test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices (SMD).

Details

Status Current
Pages 22
Language English
Supersedes
Superseded By
DocumentFormat PDF(Copy/Paste/Networkable)
Published 21-12-2009
History 2009(R2014) [20/10/2014]
2009 [21/12/2009]


Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp


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This product was added to our catalog on Saturday 10 March, 2018.

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