JIS Z 3284-2:2014Solder Paste - Part 2: Test Methods For Solder Particle Shape, Surface Condition Judgment, And Particle Size Distribution
Abstract
Describes the shape, surface condition judgment test and particle size distribution measurement test of the solder particles of solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
Details
| Status |
Current |
| Pages |
12 |
| Language |
English |
| Supersedes |
JIS Z 3284:1994 |
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-06-2014 |
| History |
2014 [20/06/2014] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.
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