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JIS Z 3284-3:2014 English Edition

$20.80
JIS Z 3284-3:2014

Solder Paste - Part 3: Test Methods For Printability, Viscosity, Slump And Tackiness

Abstract

Describes the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.

Details

Status Current
Pages 18
Language English
Supersedes JIS Z 3284:1994
Superseded By
DocumentFormat PDF(Copy/Paste/Networkable)
Published 20-06-2014
History 2014 [20/06/2014]


Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp


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