JIS Z 3284-4:2014Solder Paste - Part 4: Test Methods For Wettability, Solderball And Spread
Abstract
Defines the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
Details
Status |
Current |
Pages |
27 |
Language |
English |
Supersedes |
JIS Z 3284:1994 |
Superseded By |
|
DocumentFormat |
PDF(Copy/Paste/Networkable) |
Published |
20-06-2014 |
History |
2014 [20/06/2014] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.