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JIS C 6489:1999 English Edition
JIS C 6489:1999 Base materials for printed circuits - Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability...
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JIS C 6490:1998 English Edition
JIS C 6490:1998 Base materials for printed circuits - Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical...
$18.40
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JIS C 6492:1998 English Edition
JIS C 6492:1998 Base materials for printed circuits - Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of...
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JIS C 6493:1999 English Edition
JIS C 6493:1999 Base materials for printed circuits - Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use...
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JIS C 6494:1999 English Edition
JIS C 6494:1999 Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of...
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JIS C 6511:1992 English Edition
JIS C 6511:1992 Test Methods Of Copper Foil For Printed Wiring Boards Abstract Details Status Superseded Pages 12 Language English ...
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JIS C 6512:1992 English Edition
JIS C 6512:1992 Electrodeposited Copper Foil For Printed Wiring Boards Abstract Details Status Superseded Pages 10 Language English ...
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JIS C 6513:1996 English Edition
JIS C 6513:1996 Rolled Copper Foil For Printed Wiring Boards Abstract Details Status Superseded Pages 8 Language English Supersedes ...
$14.80
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JIS C 6515:1998 English Edition
JIS C 6515:1998 Copper foil for printed wiring boards Abstract This specification gives requirements for properties of copper toil intended for use...
$22.60
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JIS C 6520:1993 English Edition
JIS C 6520:1993 General rules of prepreg for multilayer printed wiring boards Abstract This Japanese Industrial Standard specifies basic matters...
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JSA JIS H 8451-2021 English Edition
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