Product Image	Item Name-	Price
	JIS C 6489:1999 English Edition JIS C 6489:1999 Base materials for printed circuits - Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability...	$16.60 Add:
	JIS C 6490:1998 English Edition JIS C 6490:1998 Base materials for printed circuits - Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical...	$18.40 Add:
	JIS C 6492:1998 English Edition JIS C 6492:1998 Base materials for printed circuits - Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of...	$18.40 Add:
	JIS C 6493:1999 English Edition JIS C 6493:1999 Base materials for printed circuits - Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use...	$16.00 Add:
	JIS C 6494:1999 English Edition JIS C 6494:1999 Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of...	$16.00 Add:
	JIS C 6511:1992 English Edition JIS C 6511:1992 Test Methods Of Copper Foil For Printed Wiring Boards Abstract Details Status Superseded Pages 12 Language English ...	$17.20 Add:
	JIS C 6512:1992 English Edition JIS C 6512:1992 Electrodeposited Copper Foil For Printed Wiring Boards Abstract Details Status Superseded Pages 10 Language English ...	$16.00 Add:
	JIS C 6513:1996 English Edition JIS C 6513:1996 Rolled Copper Foil For Printed Wiring Boards Abstract Details Status Superseded Pages 8 Language English Supersedes ...	$14.80 Add:
	JIS C 6515:1998 English Edition JIS C 6515:1998 Copper foil for printed wiring boards Abstract This specification gives requirements for properties of copper toil intended for use...	$22.60 Add:
	JIS C 6520:1993 English Edition JIS C 6520:1993 General rules of prepreg for multilayer printed wiring boards Abstract This Japanese Industrial Standard specifies basic matters...	$14.20 Add: