JIS C 6482:1997Copper-clad laminates for printed wiring boards - Paper base, epoxy resin
Abstract
This Japanese Industrial Standard specifies the copper-clad laminates for printed wiring boards using paper base, epoxy resin (hereafter referred to as "copper-clad laminates").
Details
| Status |
Current |
| Pages |
12 |
| Language |
English |
| Supersedes |
|
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
|
| History |
97(R2015) [20/10/2015]
97(R2010) [01/10/2010]
97(R2001) [20/09/2001]
97 [01/06/1997]
91 [01/09/1991]
86 |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.
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