JIS C 6691:2009Thermal-links - Requirements And Application Guide
Abstract
Describes the requirements for thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for indoor use, in order to protect them against excessive temperatures under abnormal conditions and the application guidance.
Details
| Status |
Current |
| Pages |
34 |
| Language |
English |
| Supersedes |
JIS C 6691:2003 |
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-03-2009 |
| History |
2009 AMD 2 2016 [20/01/2016]
2009 AMD 1 2013 [21/03/2013]
2009 [20/03/2009]
2003 ERRATA 2008 [01/11/2008]
2003 [20/12/2003]
2000 [20/03/2000] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Saturday 10 March, 2018.
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