JIS C 60068-2-69:2019 English Edition Environmental testing -- Part 2-69: Tests -
Abstract
This Standard outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations on electronic components and printed boards.
Details
| Status |
Current |
| Pages |
0 |
| Language |
English |
| Supersedes |
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| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-03-2019 |
| History |
|
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
This product was added to our catalog on Sunday 02 January, 2022.
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