JIS C 6486:1996Thin copper-clad laminates for multilayer printed wiring boards - Glass fabric base, epoxy resin
Abstract
This Japanese Industrial Standard specifies thin copper-clad laminates for multilayer printed wiring boards using glass babric base, epoxy resin (hereafter referred to as "copper-clad laminates").
Details
| Status |
Superseded |
| Pages |
12 |
| Language |
English |
| Supersedes |
|
| Superseded By |
JIS C 6484:2005 |
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
01-01-1996 |
| History |
96(R2001) [20/09/2001]
96 [01/01/1996]
90 [01/10/1990]
80 |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
