JIS C 60068-2-69:2009Environmental testing Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Abstract
This Japanese Industrial Standard specifies test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices (SMD).
Details
| Status |
Current |
| Pages |
22 |
| Language |
English |
| Supersedes |
|
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
21-12-2009 |
| History |
2009(R2014) [20/10/2014]
2009 [21/12/2009] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
