JIS Z 3284-3:2014Solder Paste - Part 3: Test Methods For Printability, Viscosity, Slump And Tackiness
Abstract
Describes the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
Details
| Status |
Current |
| Pages |
18 |
| Language |
English |
| Supersedes |
JIS Z 3284:1994 |
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-06-2014 |
| History |
2014 [20/06/2014] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
