JIS Z 3284-4:2014Solder Paste - Part 4: Test Methods For Wettability, Solderball And Spread
Abstract
Defines the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
Details
| Status |
Current |
| Pages |
27 |
| Language |
English |
| Supersedes |
JIS Z 3284:1994 |
| Superseded By |
|
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
20-06-2014 |
| History |
2014 [20/06/2014] |
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
