JIS C 6484:1997Copper-clad laminates for printed wiring boards - Glass fabric base, epoxy resin
Abstract
This Japanese Industrial Standard specifies the copper-clad laminates for printed wiring boards using glass fabric base, epoxy resin (hereafter referred to as "copper-clad laminates"). but it excluded that for multilayer printed wiring boards.
Details
| Status |
Superseded |
| Pages |
9 |
| Language |
English |
| Supersedes |
|
| Superseded By |
JIS C 6484:2005 |
| DocumentFormat |
PDF(Copy/Paste/Networkable) |
| Published |
|
| History |
|
Note
We will send the latest version to you, please contact us if you want the exact document as the title. Some old Standards are in scancopy and no reaffirmed stamp
